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Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer
https://doi.org/10.24517/00051418
https://doi.org/10.24517/00051418abeee044-e053-4f21-8887-fd5453ec6026
名前 / ファイル | ライセンス | アクション |
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TE-PR-TAKI-K-459.pdf (8.5 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2018-07-02 | |||||
タイトル | ||||||
タイトル | Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
ID登録 | ||||||
ID登録 | 10.24517/00051418 | |||||
ID登録タイプ | JaLC | |||||
著者 |
Taki, Kentaro
× Taki, Kentaro× Mizoguchi, Akira× Ito, Hiroshi |
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著者別表示 |
瀧, 健太郎
× 瀧, 健太郎 |
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提供者所属 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 金沢大学理工研究域機械工学系 | |||||
書誌情報 |
Journal of Photopolymer Science and Technology en : フォトポリマー懇話会誌 巻 29, 号 3, p. 459-464, 発行日 2016 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0914-9244 | |||||
NCID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA11576862 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.2494/photopolymer.29.459 | |||||
出版者 | ||||||
出版者 | Technical Association of Photopolymers = フォトポリマー懇話会 | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | Porous polyimide films are promising insulators for next generation electronic devices. Recently, we had developed a high-intensity UV exposure apparatus under a high-pressure CO2 gas atmosphere for the production of porous polyimide films. In this study, the cover-layering process of a porous polyimide layer on two different types of flexible print circuits (FPCs) with insulation materials made of solid polyimide and porous polyimide was examined. Although a portion of the pores above and below the copper line of the FPC collapsed, a conformal porous polyimide layer could be formed on the FPC. Through-holes were formed on the porous polyimide film by a laser ablation technique. The surface of through-holes was electro-plated in a copper-plating solution bath. A portion of the pores on the film were filled with copper as the pores were inter-connected and the plating solution penetrated the pores. The results suggest that the pores should be isolated and firm for a cover-layering process with porous polyimide films for next-generation FPCs. | |||||
権利 | ||||||
権利情報 | Copyright © Technical Association of Photopolymers フォトポリマー懇話会 | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://www.jstage.jst.go.jp/browse/photopolymer/-char/en | |||||
関連名称 | https://www.jstage.jst.go.jp/browse/photopolymer/-char/en | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | http://www.tapj.jp/ | |||||
関連名称 | http://www.tapj.jp/ |