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Application of ECT Technique for Inspection of Bare PCB
http://hdl.handle.net/2297/48321
http://hdl.handle.net/2297/48321607631e5-acce-46a1-b3d6-9b50cd1ff87f
名前 / ファイル | ライセンス | アクション |
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TE-PR-YAMADA-S-217.pdf (375.2 kB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2017-10-03 | |||||
タイトル | ||||||
タイトル | Application of ECT Technique for Inspection of Bare PCB | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Yamada, Sotoshi
× Yamada, Sotoshi× Nakamura, Kazunori× Iwahara, Masayoshi× Taniguchi, T.× Wakiwaka, H. |
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書誌情報 |
IEEE Transactions on Maggetics 巻 39, 号 5, p. 3325-3327, 発行日 2003-09-01 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0018-9464 | |||||
NCID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA00667933 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.1109/TMAG.2003.816765 | |||||
出版者 | ||||||
出版者 | Institute of Electrical and Electronics Engineers IEEE | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | The detection of imperfections (such as disconnections, chipping cracks, nonuniformity in thickness and short-circuit, etc.) on the traces of bare printed circuit board (PCB) using a new high-sensitive eddy-current testing (ECT) probe has been reported in this paper. The ECT technique is composed of planar meander type exciting coil and a new multiple solenoid sensing coil. The image processing method is used to analyze the results. This paper has discussed the structure of the new probe, the characteristics of the measurement technique to inspect high-density PCB with narrow conductor-width. And the possibility of detecting micro-metal ball has been explored. | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | A new application of eddy current testing techniques for investigating trace defects on printed circuit boards is proposed, A test probe consisting of a meander type exciting coil is used to induce eddy currents. The following three experiments are conducted: measuring the induced signal when a circuit trace is cut; measuring the induced signal for a number of traces placed in parallel and with a cut in the centre trace; measuring the induced signal for two back to back right angle traces. The experimental results reveal that it is possible to clearly detect defects and that the signal response obtained is strongly associated with a particular defect pattern. The signals obtained from a high density patterned board have a complicated signal signature and are therefore difficult to interpret. This complexity can be avoided by comparing the signal signature of a known good board with a defective board. The difference signal gives a clear indication of a trace defect. | |||||
権利 | ||||||
権利情報 | © 1997 IEEE. | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 |