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III-V/SOI heterogeneous photonic integrated devices for optical interconnection in LSI
http://hdl.handle.net/2297/20303
http://hdl.handle.net/2297/20303c103bcae-8ec8-450d-a729-3116208ed85b
名前 / ファイル | ライセンス | アクション |
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TE-PR-MARUYAMA-T-501.pdf (603.4 kB)
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Item type | 会議発表論文 / Conference Paper(1) | |||||
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公開日 | 2017-10-03 | |||||
タイトル | ||||||
タイトル | III-V/SOI heterogeneous photonic integrated devices for optical interconnection in LSI | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||
資源タイプ | conference paper | |||||
著者 |
Nishiyama, Nobuhiko
× Nishiyama, Nobuhiko× Maruyama, Takeo× Ara, Shigehisa |
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提供者所属 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 金沢大学理工研究域電子情報学系 | |||||
書誌情報 |
Conference Proceedings - International Conference on Indium Phosphide and Related Materials 巻 5012485, p. 210-214, 発行日 2009-01-01 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 1092-8669 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.1109/ICIPRM.2009.5012485 | |||||
出版者 | ||||||
出版者 | IEEE = Institute of Electrical and Electronics Engineers | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | InP-based photonic devices on SOI substrate using bonding technologies were demonstrated. Direct bonding and BCB bonding enable us to realize high optical confinement DFB lasers and other devices for intra/inter-chip connection in Si LSI circuit. Low threshold optical pumped membrane lasers and CW-operation of lateral current injection lasers with thin lateral cladding lasers were realized. ©2009 IEEE. | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
シリーズ | ||||||
関連名称 | 5012485 |