2026-03-08T17:08:52Z https://kanazawa-u.repo.nii.ac.jp/oai

oai:kanazawa-u.repo.nii.ac.jp:00009186 2024-06-20T06:14:52Z 934:935:936

ポア自生パッドの開発とそれの研磨加工への応用: 超微細ダイヤモンドによるぜい性材料の研磨 Development of polishing pad with self generating porosity: Nano-polishing of brittle material using ultra-dispersed diamonds 黒部, 利次 13084 60019742 山田, 良穂 12236 20126626 森田, 知之 13111 山中, 喜彦 13112 The pad with self generating porosity has newly been developed, which is made of the petroleum pitch and the salt grains. Polishing of a silicon wafer is conducted using a new pad which is immersed into the slurry of the ultra-dispersed super fine diamonds. It is found that the surface roughness of silicon wafer decreases drastically with the polishing time, in which the slurry of polycrystalline diamonds yields a rapid decrease of surface roughness rather than that of singlecrystalline diamonds. Experiments show that the developed pad has an excellent performance for polishing of the silicon wafer rather than the conventional vesicant polyurethane pad. journal article 精密工学会 = The Japan Society for Precision Engineering 2004-01-01 VoR application/pdf 精密工学会誌論文集 = Journal of the Japan Society for Precision Engineering. Supplement. Contributed papers 10 70 1281 1285 AA11966630 1348-8724 https://kanazawa-u.repo.nii.ac.jp/record/9186/files/TE-PR-KUROBE-T-1281.pdf http://hdl.handle.net/2297/43203 https://kanazawa-u.repo.nii.ac.jp/records/9186 jpn 10.2493/jspe.70.1281 http://www.jspe.or.jp/ https://www.jstage.jst.go.jp/browse/jspe/-char/ja/ Copyright © The Japan Society for Precision Engineering 精密工学会