@article{oai:kanazawa-u.repo.nii.ac.jp:00010540,
 author = {串崎, 義幸 and 中村, 省三 and 多田, 薫 and 山田, 敏郎},
 issue = {2},
 journal = {成形加工 = Journal of the Japan Society of Polymer Processing},
 month = {Feb},
 note = {In recent years, the study of Chip on Board (COB) structures with LSI chips mounted on the substrate has attracted much attention. One of the main technical problems is that the internal electrical wires may disconnect during the heat cycle process due to the differences in the thermal expansion coefficients between component materials. In order to prevent thermal expansion deformation the wires are encased in resin. Until now, the relationship between the physical properties of the resin and the thermal residual stress in the wires has been seldom reported. In this work, the influence of resin physical properties on the thermal residual stress generated during the heat cycle process was theoretically analyzed via finite element analysis. The results show that the thermal residual stress generated in the wire during the heating process is larger than that during the cooling process. During heating the thermal residual stress was influenced by the storage modulus of the rubbery state (ER).},
 pages = {149--155},
 title = {ヒートサイクル信頼性評価中での配線間に生ずる熱残留応力の有限要素解析による予測},
 volume = {18},
 year = {2006}
}