{"created":"2023-07-27T06:40:27.738015+00:00","id":29291,"links":{},"metadata":{"_buckets":{"deposit":"762427f7-2bd6-47e9-8f29-3a6eaabe1123"},"_deposit":{"created_by":3,"id":"29291","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"29291"},"status":"published"},"_oai":{"id":"oai:kanazawa-u.repo.nii.ac.jp:00029291","sets":["1979:1980:1981"]},"author_link":["11069","11068","50268"],"item_4_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2007-06-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"6","bibliographicPageEnd":"2396","bibliographicPageStart":"2394","bibliographicVolumeNumber":"43","bibliographic_titles":[{"bibliographic_title":"IEEE Transactions on Magnetics"}]}]},"item_4_description_21":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"This paper describes the improvement on the defect detection performance of printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique with the multispin-valve giant magnetoresistance (SV-GMR) sensor. To obtain the ECT signal in the same scanning line, SV-GMR sensors are mounted on the exciting coil in the same column parallel with the scanning direction. Harmonic analysis based on the Fourier transform is used to analyze the signal from the SV-GMR sensor in order to increase scanning speed. Then signal averaging is applied to the ECT signal in order to improve the signal-to-noise ratio. Experimental results are performed to verify the inspection performance. © 2007 IEEE.","subitem_description_type":"Abstract"}]},"item_4_description_5":{"attribute_name":"提供者所属","attribute_value_mlt":[{"subitem_description":"金沢大学環日本海域環境研究センター生体機能計測研究部門","subitem_description_type":"Other"}]},"item_4_publisher_17":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"IEEE"}]},"item_4_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.1109/TMAG.2007.893480","subitem_relation_type_select":"DOI"}}]},"item_4_relation_28":{"attribute_name":"関連URI","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://dx.doi.org/10.1109/TMAG.2007.893480","subitem_relation_type_select":"DOI"}}]},"item_4_rights_23":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"© IEEE 2007"}]},"item_4_source_id_11":{"attribute_name":"NCID","attribute_value_mlt":[{"subitem_source_identifier":"AA00667933","subitem_source_identifier_type":"NCID"}]},"item_4_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0018-9464","subitem_source_identifier_type":"ISSN"}]},"item_4_version_type_25":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Chomsuwan, K."}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yamada, Sotoshi"}],"nameIdentifiers":[{},{},{}]},{"creatorNames":[{"creatorName":"Iwahara, Masayoshi"}],"nameIdentifiers":[{},{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-10-05"}],"displaytype":"detail","filename":"TE-PR-YAMADA-S-21.pdf","filesize":[{"value":"1.0 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"TE-PR-YAMADA-S-21.pdf","url":"https://kanazawa-u.repo.nii.ac.jp/record/29291/files/TE-PR-YAMADA-S-21.pdf"},"version_id":"28366bd9-f1d7-4d00-8f61-eea0a70b3bca"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Improvement on defect detection performance of PCB inspection based on ECT technique with multi-SV-GMR sensor","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Improvement on defect detection performance of PCB inspection based on ECT technique with multi-SV-GMR sensor"}]},"item_type_id":"4","owner":"3","path":["1981"],"pubdate":{"attribute_name":"公開日","attribute_value":"2017-10-05"},"publish_date":"2017-10-05","publish_status":"0","recid":"29291","relation_version_is_last":true,"title":["Improvement on defect detection performance of PCB inspection based on ECT technique with multi-SV-GMR sensor"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-07-27T20:37:43.695014+00:00"}