@techreport{oai:kanazawa-u.repo.nii.ac.jp:00034470,
 month = {Sep},
 note = {電子基板に対して波長可変レーザー光を照射し，スペックル干渉計を通して多数の干渉像を取込み，微小振動が残る環境下でも３次元形状を計測できる方法を開発した．ランダム振動環境下で干渉像を多数枚取り込むと，画像間の位相シフト量はランダムな変化となる．画像内の異なる２画素における光強度の最大値・最小値を利用した２回規格化からこの位相シフト量を計算し，取り込んでいる光強度の変化から最小二乗近似で干渉像の位相値をカメラの全画素で計算する．実験ではレーザー波長を７種変えて全体で140枚の干渉像を取込み，６種の波長変更に伴う６種の位相変化分布から電子基板の３次元形状を計算した．, We have developed a 3D-shape measurement technique of an electronic substrate with electronic parts using a wavelength variable laser. In the technique many speckle interferograms are captured under small random vibrations in environment. These vibrations would make phase shifts between the captured interferograms random. Amounts of these shifts are calculated through Max & Min light intensities searchings at two different pixels in frames and twin normalizations of their intensity changes. The calculated shifts and light-intensity changes at pixels are used to extract phase distribution with the Least-Squares Algorithm. During the laser wavelength is varied from 778.20nm to 780.28nm, 140 specklegrams are captured, and phase distributions are extracted regarding 7 different wavelengths. The ratios of phase change against wavelength change are extracted at all pixels of the frame. 3D shape is then calculated from the obtained ratios., 研究課題/領域番号:24560289, 研究期間(年度):2012-04-01 – 2015-03-31, 出典：研究課題「電子基板上の部品群の高精度3次元形状計測技術の開発」課題番号24560289
（KAKEN：科学研究費助成事業データベース（国立情報学研究所）） 
（https://kaken.nii.ac.jp/report/KAKENHI-PROJECT-24560289/24560289seika/）を加工して作成, 金沢大学理工学域機械工学系},
 title = {電子基板上の部品群の高精度3次元形状計測技術の開発},
 year = {2015}
}