{"created":"2023-07-27T06:50:50.383789+00:00","id":43976,"links":{},"metadata":{"_buckets":{"deposit":"13356025-e274-439e-8e4d-183f97549c24"},"_deposit":{"created_by":18,"id":"43976","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"43976"},"status":"published"},"_oai":{"id":"oai:kanazawa-u.repo.nii.ac.jp:00043976","sets":["934:935:936"]},"author_link":["72941","72946","72940","72942","11667","72936","72938","72945","72937","72939","72933","72934","72944","72932","72931","12262"],"item_4_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"F32","bibliographicPageStart":"235","bibliographicVolumeNumber":"2003 Spring","bibliographic_titles":[{"bibliographic_title":"精密工学会学術講演会講演論文集"},{"bibliographic_title":"2003 JSPE Spring Meeting","bibliographic_titleLang":"en"}]}]},"item_4_creator_33":{"attribute_name":"著者別表示","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Ichikawa, Takeshi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Kinai, Fumiaki"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yasuda, Hirosi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Fukunaga, Moritaka"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yamada, Toshiro"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"Furuno, Kazuhiro"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yokoyama, Atsushi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ooshita, Takashi"}],"nameIdentifiers":[{}]}]},"item_4_description_21":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"近年、コストを抑えてより大量のデバイスチップを製造するために、基盤となるシリコンウエハは300mm、400mmと大口径化が進められている．現在主流となりつつあるワイヤーソー装置はウエハ一枚一枚の生産管理が困難である．そのためウエハ加工精度を落とさずにインゴットを切削する最適な条件の見極めが重要となる．報告者らは2002年度秋季大会にて既にシリコンウエハのWarp量と形状についてその発生メカニズムを明らかにした．本研究では引き続き切削の際ワイヤーとインゴットとの間で発生する熱に着目し、切削条件を様々に変化させWarp量低減を試みた.","subitem_description_type":"Abstract"}]},"item_4_description_22":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"出版者照会後に全文公開","subitem_description_type":"Other"}]},"item_4_description_5":{"attribute_name":"提供者所属","attribute_value_mlt":[{"subitem_description":"金沢大学理工研究域機械工学系","subitem_description_type":"Other"}]},"item_4_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24517/00050318","subitem_identifier_reg_type":"JaLC"}]},"item_4_publisher_17":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"精密工学会 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© The Japan Society for Precision Engineering"}]},"item_4_version_type_25":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"市川, 武志"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"喜内, 文晃"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"保田, 洋志"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"福永, 守高"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"山田, 敏郎"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"古野, 一裕"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"横山, 敦士"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"大下, 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of Slicing Conditions by Wire-Saw on Warp of Silicon Wafer","subitem_title_language":"en"}]},"item_type_id":"4","owner":"18","path":["936"],"pubdate":{"attribute_name":"公開日","attribute_value":"2018-06-14"},"publish_date":"2018-06-14","publish_status":"0","recid":"43976","relation_version_is_last":true,"title":["ワイヤーソー切削条件がシリコンウエハWarp量に及ぼす影響"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2023-07-27T17:05:28.972072+00:00"}