{"created":"2023-07-27T06:51:35.789519+00:00","id":45079,"links":{},"metadata":{"_buckets":{"deposit":"334ba41e-0e14-419b-b457-df9071408297"},"_deposit":{"created_by":18,"id":"45079","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"45079"},"status":"published"},"_oai":{"id":"oai:kanazawa-u.repo.nii.ac.jp:00045079","sets":["934:935:936"]},"author_link":["78441","78425","78440"],"item_4_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2016","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"3","bibliographicPageEnd":"464","bibliographicPageStart":"459","bibliographicVolumeNumber":"29","bibliographic_titles":[{"bibliographic_title":"Journal of Photopolymer Science and Technology"},{"bibliographic_title":"フォトポリマー懇話会誌","bibliographic_titleLang":"en"}]}]},"item_4_creator_33":{"attribute_name":"著者別表示","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"瀧, 健太郎"}],"nameIdentifiers":[{},{}]}]},"item_4_description_21":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Porous polyimide films are promising insulators for next generation electronic devices. Recently, we had developed a high-intensity UV exposure apparatus under a high-pressure CO2 gas atmosphere for the production of porous polyimide films. In this study, the cover-layering process of a porous polyimide layer on two different types of flexible print circuits (FPCs) with insulation materials made of solid polyimide and porous polyimide was examined. Although a portion of the pores above and below the copper line of the FPC collapsed, a conformal porous polyimide layer could be formed on the FPC. Through-holes were formed on the porous polyimide film by a laser ablation technique. The surface of through-holes was electro-plated in a copper-plating solution bath. A portion of the pores on the film were filled with copper as the pores were inter-connected and the plating solution penetrated the pores. The results suggest that the pores should be isolated and firm for a cover-layering process with porous polyimide films for next-generation FPCs.","subitem_description_type":"Abstract"}]},"item_4_description_5":{"attribute_name":"提供者所属","attribute_value_mlt":[{"subitem_description":"金沢大学理工研究域機械工学系","subitem_description_type":"Other"}]},"item_4_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.24517/00051418","subitem_identifier_reg_type":"JaLC"}]},"item_4_publisher_17":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"Technical Association of Photopolymers = フォトポリマー懇話会"}]},"item_4_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.2494/photopolymer.29.459","subitem_relation_type_select":"DOI"}}]},"item_4_relation_28":{"attribute_name":"関連URI","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"https://www.jstage.jst.go.jp/browse/photopolymer/-char/en"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://www.jstage.jst.go.jp/browse/photopolymer/-char/en","subitem_relation_type_select":"URI"}},{"subitem_relation_name":[{"subitem_relation_name_text":"http://www.tapj.jp/"}],"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://www.tapj.jp/","subitem_relation_type_select":"URI"}}]},"item_4_rights_23":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright © Technical Association of Photopolymers フォトポリマー懇話会"}]},"item_4_source_id_11":{"attribute_name":"NCID","attribute_value_mlt":[{"subitem_source_identifier":"AA11576862","subitem_source_identifier_type":"NCID"}]},"item_4_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0914-9244","subitem_source_identifier_type":"ISSN"}]},"item_4_version_type_25":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Taki, Kentaro"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"Mizoguchi, Akira"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ito, Hiroshi"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-07-02"}],"displaytype":"detail","filename":"TE-PR-TAKI-K-459.pdf","filesize":[{"value":"8.5 MB"}],"format":"application/pdf","licensetype":"license_11","mimetype":"application/pdf","url":{"label":"TE-PR-TAKI-K-459.pdf","url":"https://kanazawa-u.repo.nii.ac.jp/record/45079/files/TE-PR-TAKI-K-459.pdf"},"version_id":"86a21d85-0dcf-48c3-be63-79a345886ceb"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer"}]},"item_type_id":"4","owner":"18","path":["936"],"pubdate":{"attribute_name":"公開日","attribute_value":"2018-07-02"},"publish_date":"2018-07-02","publish_status":"0","recid":"45079","relation_version_is_last":true,"title":["Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2023-07-27T17:00:45.522469+00:00"}