@article{oai:kanazawa-u.repo.nii.ac.jp:00009060,
 author = {山田, 啓司 and 森田, 精一 and 上田, 隆司 and 細川, 晃 and 田中, 隆太郎},
 issue = {3},
 journal = {Journal of the Japan Society for Precision Engineering, Contributed Papers = 精密工学会誌論文集},
 month = {Mar},
 note = {In this paper, a refrigerating chuck system is developed to reduce the thermal damages of workpiece in laser cleaving process. The system reduces the surface temperature of table below the freezing point of water, and the work material is fixed on the table by the frozen water between the material and the table. The cooling capability of the system is investigated. The system is applied to the laser cleaving process of silicon wafer with cw-Nd:YAG laser. The laser cleaving experiment of silicon wafer is conducted with Nd:YAG laser, then the width of thermal affected zone on the irradiated surface, the roughness of fractured surface and the deviation of cleaving trajectory are measured. The silicon oxide is caused on the surface of wafer in the room temperature, but the refrigerating chuck can prevent the thermal damage and improve the reliability of the cleaving process. By use of the chuck, the smooth fractured surface is achieved and the linearity of the cleaving trajectory is also improved.},
 pages = {393--397},
 title = {Nd:YAGレーザによるSiウエハの割断加工に関する研究: 冷凍チャックシステムによる効果},
 volume = {72},
 year = {2006}
}