@article{oai:kanazawa-u.repo.nii.ac.jp:00009186,
 author = {黒部, 利次 and 山田, 良穂 and 森田, 知之 and 山中, 喜彦},
 issue = {10},
 journal = {精密工学会誌論文集 = Journal of the Japan Society for Precision Engineering. Supplement. Contributed papers},
 month = {Jan},
 note = {The pad with self generating porosity has newly been developed, which is made of the petroleum pitch and the salt grains. Polishing of a silicon wafer is conducted using a new pad which is immersed into the slurry of the ultra-dispersed super fine diamonds. It is found that the surface roughness of silicon wafer decreases drastically with the polishing time, in which the slurry of polycrystalline diamonds yields a rapid decrease of surface roughness rather than that of singlecrystalline diamonds. Experiments show that the developed pad has an excellent performance for polishing of the silicon wafer rather than the conventional vesicant polyurethane pad.},
 pages = {1281--1285},
 title = {ポア自生パッドの開発とそれの研磨加工への応用: 超微細ダイヤモンドによるぜい性材料の研磨},
 volume = {70},
 year = {2004}
}