{"created":"2023-07-27T06:25:45.420111+00:00","id":9186,"links":{},"metadata":{"_buckets":{"deposit":"a3a9f4b0-f4dd-4f64-a236-310b9ce28e89"},"_deposit":{"created_by":3,"id":"9186","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"9186"},"status":"published"},"_oai":{"id":"oai:kanazawa-u.repo.nii.ac.jp:00009186","sets":["934:935:936"]},"author_link":["13084","12236","13111","13112"],"item_4_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2004-01-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"10","bibliographicPageEnd":"1285","bibliographicPageStart":"1281","bibliographicVolumeNumber":"70","bibliographic_titles":[{"bibliographic_title":"精密工学会誌論文集 = Journal of the Japan Society for Precision Engineering. Supplement. Contributed papers"}]}]},"item_4_description_21":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"The pad with self generating porosity has newly been developed, which is made of the petroleum pitch and the salt grains. Polishing of a silicon wafer is conducted using a new pad which is immersed into the slurry of the ultra-dispersed super fine diamonds. It is found that the surface roughness of silicon wafer decreases drastically with the polishing time, in which the slurry of polycrystalline diamonds yields a rapid decrease of surface roughness rather than that of singlecrystalline diamonds. Experiments show that the developed pad has an excellent performance for polishing of the silicon wafer rather than the conventional vesicant polyurethane pad.","subitem_description_type":"Abstract"}]},"item_4_publisher_17":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"精密工学会 = The Japan Society for Precision Engineering"}]},"item_4_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.2493/jspe.70.1281","subitem_relation_type_select":"DOI"}}]},"item_4_relation_28":{"attribute_name":"関連URI","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://www.jspe.or.jp/","subitem_relation_type_select":"URI"}},{"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://www.jstage.jst.go.jp/browse/jspe/-char/ja/","subitem_relation_type_select":"URI"}}]},"item_4_rights_23":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright © The Japan Society for Precision Engineering 精密工学会"}]},"item_4_source_id_11":{"attribute_name":"NCID","attribute_value_mlt":[{"subitem_source_identifier":"AA11966630","subitem_source_identifier_type":"NCID"}]},"item_4_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"1348-8724","subitem_source_identifier_type":"ISSN"}]},"item_4_version_type_25":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"黒部, 利次"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"山田, 良穂"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"森田, 知之"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"山中, 喜彦"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-10-03"}],"displaytype":"detail","filename":"TE-PR-KUROBE-T-1281.pdf","filesize":[{"value":"915.1 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"TE-PR-KUROBE-T-1281.pdf","url":"https://kanazawa-u.repo.nii.ac.jp/record/9186/files/TE-PR-KUROBE-T-1281.pdf"},"version_id":"90d2e181-19ab-40c2-86b6-9f7ac45855bd"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"ポア自生パッドの開発とそれの研磨加工への応用: 超微細ダイヤモンドによるぜい性材料の研磨","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"ポア自生パッドの開発とそれの研磨加工への応用: 超微細ダイヤモンドによるぜい性材料の研磨"},{"subitem_title":"Development of polishing pad with self generating porosity: Nano-polishing of brittle material using ultra-dispersed diamonds","subitem_title_language":"en"}]},"item_type_id":"4","owner":"3","path":["936"],"pubdate":{"attribute_name":"公開日","attribute_value":"2017-10-03"},"publish_date":"2017-10-03","publish_status":"0","recid":"9186","relation_version_is_last":true,"title":["ポア自生パッドの開発とそれの研磨加工への応用: 超微細ダイヤモンドによるぜい性材料の研磨"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-07-28T01:57:54.196378+00:00"}