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YAGレーザによるシリコンウエハの精密割断: 鏡面冷却二重照射割断
http://hdl.handle.net/2297/42782
http://hdl.handle.net/2297/427825e091699-acc4-43fa-b9b9-9961fab71bd6
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
TE-PR-KUROBE-T-95.pdf (1.3 MB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2017-10-03 | |||||
| タイトル | ||||||
| タイトル | YAGレーザによるシリコンウエハの精密割断: 鏡面冷却二重照射割断 | |||||
| タイトル | ||||||
| タイトル | Precision Breaking of a Silicon Wafer by YAG Laser: double Irradiation Breaking Assisted by Mirror Surface Cooling | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | jpn | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| 著者 |
黒部, 利次
× 黒部, 利次× 野口, 通一× 松本, 貴宏 |
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| 書誌情報 |
精密工学会誌 = Journal of the Japan Society for Precision Engineering 巻 62, 号 1, p. 95-99, 発行日 1996-01-01 |
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| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 0912-0289 | |||||
| NCID | ||||||
| 収録物識別子タイプ | NCID | |||||
| 収録物識別子 | AN1003250X | |||||
| DOI | ||||||
| 関連タイプ | isIdenticalTo | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.2493/jjspe.62.95 | |||||
| 出版者 | ||||||
| 出版者 | 精密工学会 = The Japan Society for Precision Engineering | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | This paper describes some experiments for breaking a silicon wafer precisely using YAG laser. The popular mechanical cutting of a silicon wafer using a diamond blade is not always high quality. The noncontact cutting of ceramics using CO2 laser is recently being studied enthusiastically. The precise breaking of a silicon wafer, however, has never been achieved. In the experiments, the conditions and the quality of double irradiation breaking are searched in various atmospheres. It is found that air cooling, water cooling and assist gas method has similar breaking forms. Main crack meanders and it is accompanied with some branching cracks which deteriorate the breaking quality of a silicon wafer. However, local cooling method enabled high quality breaking. The measurement results of the surface roughness of cross section are extremely small, 0.003-0.004 μm at Ra. It is also shown that the crack propagation velocity of local cooling breaking is about 10m/s higher than that of other ones. | |||||
| 権利 | ||||||
| 権利情報 | Copyright © The Japan Society for Precision Engineering 精密工学会 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | https://www.jstage.jst.go.jp/browse/jjspe/-char/ja/ | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://www.jspe.or.jp/ | |||||
