@article{oai:kanazawa-u.repo.nii.ac.jp:00009526,
 author = {Chomsuwan, K. and Yamada, Sotoshi and Iwahara, Masayoshi and Wakiwaka, H. and Shoji, S.},
 issue = {10},
 journal = {IEEE Transactions on Maggetics},
 month = {Oct},
 note = {High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning.},
 pages = {3619--3621},
 title = {Application of Eddy-Current Testing Technique for High-Density Double-Layer Printed circuit Board Inspection},
 volume = {41},
 year = {2005}
}