{"created":"2023-07-27T06:26:00.473296+00:00","id":9543,"links":{},"metadata":{"_buckets":{"deposit":"858dcf8f-0cd4-48eb-9a83-7c46c3213eff"},"_deposit":{"created_by":3,"id":"9543","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"9543"},"status":"published"},"_oai":{"id":"oai:kanazawa-u.repo.nii.ac.jp:00009543","sets":["934:935:936"]},"author_link":["11069","13788","13789","11068"],"item_4_biblio_info_8":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2008-11-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"11","bibliographicPageEnd":"4017","bibliographicPageStart":"4015","bibliographicVolumeNumber":"44","bibliographic_titles":[{"bibliographic_title":"IEEE Transactions on Maggetics"}]}]},"item_4_description_21":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"In this paper we propose a model to reproduce printed circuit board (PCB) pattern eddy current testing signals based on 3D finiteelement method (FEM) package and scanning simulation. In this method we consider some common PCB elements as test pieces while a simple Meander-type coil is utilized as excitation coil above the elements. Numerical solution to the above problem with the help of a 3D FEM provides the magnetic flux density in the region above the PCB test elements. Shifting the test element's position step by step and repeating the numerical calculation for each of the test elements new positions, the scanning process of a PCB test piece is simulated. Analysing and smoothing the magnetic field data from all of the aforementioned steps provide the final PCB pattern signal. Image processing technique was applied to obtain the PCB part image.","subitem_description_type":"Abstract"}]},"item_4_publisher_17":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"Institute of Electrical and Electronics Engineers IEEE"}]},"item_4_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"10.1109/TMAG.2008.2002864","subitem_relation_type_select":"DOI"}}]},"item_4_rights_23":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"© 2008 IEEE."}]},"item_4_source_id_11":{"attribute_name":"NCID","attribute_value_mlt":[{"subitem_source_identifier":"AA00667933","subitem_source_identifier_type":"NCID"}]},"item_4_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0018-9464","subitem_source_identifier_type":"ISSN"}]},"item_4_version_type_25":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Bayani, H."}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Nishino, M."}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yamada, Sotoshi"}],"nameIdentifiers":[{},{},{}]},{"creatorNames":[{"creatorName":"Iwahara, Masayoshi"}],"nameIdentifiers":[{},{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-10-03"}],"displaytype":"detail","filename":"TE-PR-YAMADA-S-286.pdf","filesize":[{"value":"299.3 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"TE-PR-YAMADA-S-286.pdf","url":"https://kanazawa-u.repo.nii.ac.jp/record/9543/files/TE-PR-YAMADA-S-286.pdf"},"version_id":"9e60d057-f0d0-46c8-a7e2-96a5e4d6eb65"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Introduction of a Base-Model for Eddy Current Testing of Printed Circuits Boards","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Introduction of a Base-Model for Eddy Current Testing of Printed Circuits Boards"}]},"item_type_id":"4","owner":"3","path":["936"],"pubdate":{"attribute_name":"公開日","attribute_value":"2017-10-03"},"publish_date":"2017-10-03","publish_status":"0","recid":"9543","relation_version_is_last":true,"title":["Introduction of a Base-Model for Eddy Current Testing of Printed Circuits Boards"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-07-28T01:52:51.630963+00:00"}