Analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulators: Part IV Stress-Strain Analysis with Fracture Model on Interface of Epoxy Resin
アイテムタイプ
学術雑誌論文 / Journal Article
言語
日本語
キーワード
Epoxy resin, Adhesion, Failure, Finite element analysis
成形加工 = Journal of the Japan Society of Polymer Processing
巻
15
号
6
ページ
424 - 428
発行年
2003-06-20
ISSN
0915-4027
NCID
AN10278882
DOI
10.4325/seikeikakou.15.424
出版者
The Japan Society of Polymer Processing = プラスチック成形加工学会
抄録
Our previous report proposed a gradual adhesion model for the interface of epoxy resin used as an electric insulator. The model can deal with the flow and gelling of epoxy resin but it cannot deal with the fracture of the interface. In order to solve the fracture problem, two new fracture models are proposed for the epoxy resin interface. 1) One model proposes that partial adhesion remains after the fracture of the interface of epoxy resin occurs. The calculated strain change using this model does not give good agreement with experimental values. 2) Another model proposes that partial adhesion remains after the shrinkage strain from the curing reaction is released by the fracture of the interface. The calculated strain change from this model gives good agreement with experimental values. These results indicate that the weak adhesion region breaks away when the fracture of the epoxy resin interface occurs. The temperature distribution of the epoxy resin during the curing reaction does not change with the fracture of the interface. The internal stress of the epoxy resin goes up with the adhesion and goes down with the fracture of the epoxy resin interface.
絶縁用封止材として使われるエポキシ樹脂硬化反応の解析: 第4報 エポキシ樹脂の界面の破壊モデルによる応力-ひずみ解析
TE-PR-YAMADA-T-424.pdf
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