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絶縁用封止材として使われるエポキシ樹脂硬化反応の解析: 第4報 エポキシ樹脂の界面の破壊モデルによる応力-ひずみ解析
http://hdl.handle.net/2297/36564
http://hdl.handle.net/2297/365641a966516-896f-40a9-bc30-b2f593a3adb0
名前 / ファイル | ライセンス | アクション |
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TE-PR-YAMADA-T-424.pdf (4.3 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2017-10-03 | |||||
タイトル | ||||||
タイトル | 絶縁用封止材として使われるエポキシ樹脂硬化反応の解析: 第4報 エポキシ樹脂の界面の破壊モデルによる応力-ひずみ解析 | |||||
タイトル | ||||||
言語 | en | |||||
タイトル | Analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulators: Part IV Stress-Strain Analysis with Fracture Model on Interface of Epoxy Resin | |||||
言語 | ||||||
言語 | jpn | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
福永, 守高
× 福永, 守高× 山田, 敏郎× 北, 健太郎× 蒲生, 正浩× 加納, 重義 |
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書誌情報 |
成形加工 = Journal of the Japan Society of Polymer Processing 巻 15, 号 6, p. 424-428, 発行日 2003-06-20 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0915-4027 | |||||
NCID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AN10278882 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.4325/seikeikakou.15.424 | |||||
出版者 | ||||||
出版者 | The Japan Society of Polymer Processing = プラスチック成形加工学会 | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | Our previous report proposed a gradual adhesion model for the interface of epoxy resin used as an electric insulator. The model can deal with the flow and gelling of epoxy resin but it cannot deal with the fracture of the interface. In order to solve the fracture problem, two new fracture models are proposed for the epoxy resin interface. 1) One model proposes that partial adhesion remains after the fracture of the interface of epoxy resin occurs. The calculated strain change using this model does not give good agreement with experimental values. 2) Another model proposes that partial adhesion remains after the shrinkage strain from the curing reaction is released by the fracture of the interface. The calculated strain change from this model gives good agreement with experimental values. These results indicate that the weak adhesion region breaks away when the fracture of the epoxy resin interface occurs. The temperature distribution of the epoxy resin during the curing reaction does not change with the fracture of the interface. The internal stress of the epoxy resin goes up with the adhesion and goes down with the fracture of the epoxy resin interface. | |||||
権利 | ||||||
権利情報 | Copyright © The Japan Society of Polymer Processing プラスチック成形加工学会 | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://www.jstage.jst.go.jp/browse/seikeikakou/-char/ja/ | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | http://ci.nii.ac.jp/naid/10011456376/ | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | http://www.jspp.or.jp/ |