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The studies are summarized as follows : (1) The fracture conditions of the practical electronic boards such as the printed electronic circuit boards and IC boards are analyzed in the viewpoints of board shape, material composition and dynamical load conditions (2) The numerical technique to analyze the thermal stresses and strains of electronic circuit boards is proposed by using the special finite element method. The method is the application technique to analyze the adhesive bonded structure. By using the technique, the thermal stress and strain distributions of several electronic circuit boards are analyzed three-dimensionally. (3) The models simulating the practical electronic circuits are used to analyze experimentally the thermal strain distributions. 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By using the technique, the thermal stress and strain distributions of several electronic circuit boards are analyzed three-dimensionally.\n(3) The models simulating the practical electronic circuits are used to analyze experimentally the thermal strain distributions. 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IC基板の応力・ひずみ解析法とその回路破損防止に関する研究
http://hdl.handle.net/2297/46887
http://hdl.handle.net/2297/468875d371d91-ff25-4314-92d7-a5f4ef306cd3
名前 / ファイル | ライセンス | アクション |
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TE-PR-ODA-J-kaken 1990.pdf (1.1 MB)
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Item type | 報告書 / Research Paper(1) | |||||
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公開日 | 2017-10-05 | |||||
タイトル | ||||||
タイトル | IC基板の応力・ひずみ解析法とその回路破損防止に関する研究 | |||||
タイトル | ||||||
言語 | en | |||||
タイトル | Analyses of Stress and Strain in IC Board and Prevention techniques of Board Fracture | |||||
言語 | ||||||
言語 | jpn | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_18ws | |||||
資源タイプ | research report | |||||
著者別表示 |
Oda, Juhachi
× Oda, Juhachi |
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書誌情報 |
平成1(1989)年度 科学研究費補助金 一般研究(B) 研究成果報告書 en : 1989 Fiscal Year Final Research Report 巻 1988-1989, p. 52p., 発行日 1990-03-01 |
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出版者 | ||||||
出版者 | 金沢大学工学部 | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | 2ヶ年間にわたる本研究の成果は、理論、実験の両面に分けられ、かつそれらを研究分担者と対応づけて要約すれば、次のようになる。1.理論研究(1)IC基板の強度的問題点の把握 尾田は実用IC基板の破損や破壊がどのような環境下で生ずるものであるが、またそれらの破損、破壊の発生場所いや力学的条件について、多くの企業情報をもとに明らかにした。(2)IC基板の応力・ひずみ解析用有限要素法とその応用 尾田は接着構造体が熱負荷を受けるときの応力場を3次元的に簡便に求める有限要素法を考案した。さらにそれを山崎、坂本らは2層のみでなく、任意のn層が3次元的に複雑に複合している多層体へも拡張できることを示した。このような理論を用いて、実用的プリント基板の回路形状や膜厚の変化が回路応力に及ぼす影響およびレジンモ-ルドされたIC基板における詳細な応力分布が解析された。そしてその結果から回路の破損、破壊防止策が種々検討された。 2.実験研究(1)基板用薄膜の機械的特性評価法の研究 北川、門前らはIC基板に用いられている薄膜の機械的特性がバルク材から予測されるものと異なる点に注目し、それら特性を正確に求める試験法を薄膜のみで行うものと、薄膜と基板から成る2層材で行う方法とに分けて考究した。(2)IC基板モデルの熱応力・ひずみ測定実験と評価 木田・坂本らはCu-高分子材からなる拡大IC基板モデルを作製し、これに各種の熱負荷を与え、その回路各部に生ずる熱ひずみを高温ひずみゲ-ジ法によって測定した。またその結果を先の理論研究(2)でのFEM解析結果と比較して両手法の妥当性を評価した。 Experimental and theoretical techniques to the thermal stresses of electronic circuit boards and to prevent the board fractures are studied. The studies are summarized as follows : (1) The fracture conditions of the practical electronic boards such as the printed electronic circuit boards and IC boards are analyzed in the viewpoints of board shape, material composition and dynamical load conditions (2) The numerical technique to analyze the thermal stresses and strains of electronic circuit boards is proposed by using the special finite element method. The method is the application technique to analyze the adhesive bonded structure. By using the technique, the thermal stress and strain distributions of several electronic circuit boards are analyzed three-dimensionally. (3) The models simulating the practical electronic circuits are used to analyze experimentally the thermal strain distributions. The results are compared with the theoretical results by the finite element method. | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | Experimental and theoretical techniques to the thermal stresses of electronic circuit boards and to prevent the board fractures are studied. The studies are summarized as follows : (1) The fracture conditions of the practical electronic boards such as the printed electronic circuit boards and IC boards are analyzed in the viewpoints of board shape, material composition and dynamical load conditions (2) The numerical technique to analyze the thermal stresses and strains of electronic circuit boards is proposed by using the special finite element method. The method is the application technique to analyze the adhesive bonded structure. By using the technique, the thermal stress and strain distributions of several electronic circuit boards are analyzed three-dimensionally. (3) The models simulating the practical electronic circuits are used to analyze experimentally the thermal strain distributions. The results are compared with the theoretical results by the finite element method. |
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内容記述 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 研究課題/領域番号:63460077, 研究期間(年度):1988–1989, 平成1(1989)年度 科学研究費補助金 一般研究(B) 研究成果報告書の一部(概要)を掲載. | |||||
内容記述 | ||||||
内容記述タイプ | Other | |||||
内容記述 | 出典:「IC基板の応力・ひずみ解析法とその回路破損防止に関する研究」研究成果報告書 課題番号63460077 (KAKEN:科学研究費助成事業データベース(国立情報学研究所)) 本文データは著者版報告書より作成 |
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著者版フラグ | ||||||
出版タイプ | AM | |||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://kaken.nii.ac.jp/search/?qm=30019749 | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-63460077/ | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://kaken.nii.ac.jp/report/KAKENHI-PROJECT-63460077/634600771989kenkyu_seika_hokoku_gaiyo/ |