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絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
http://hdl.handle.net/2297/36561
http://hdl.handle.net/2297/36561d3212d51-85ab-4d88-851c-c7afae1daa0f
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
TE-PR-YAMADA-T-371.pdf (2.1 MB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2017-10-03 | |||||
| タイトル | ||||||
| タイトル | 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析 | |||||
| タイトル | ||||||
| タイトル | Analysis of Curing Reaction for Epoxy Resin Used for Electrical Insulators: Part I Kinetic Analysis of Curing Reaction | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | jpn | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| 著者 |
福永, 守高
× 福永, 守高× 山田, 敏郎× 加納, 重義× 蒲生, 正浩 |
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| 書誌情報 |
成形加工 = Journal of the Japan Society of Polymer Processing 巻 14, 号 6, p. 371-377, 発行日 2002-06-20 |
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| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 0915-4027 | |||||
| NCID | ||||||
| 収録物識別子タイプ | NCID | |||||
| 収録物識別子 | AN10278882 | |||||
| DOI | ||||||
| 関連タイプ | isIdenticalTo | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.4325/seikeikakou.14.371 | |||||
| 出版者 | ||||||
| 出版者 | The Japan Society of Polymer Processing = プラスチック成形加工学会 | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | Epoxy resins have been widely used as insulators in electronic devices because of the in excellent electrical properties. Cracking of the epoxy resin (interface) is a problem during the curing process, hence many experimental investigations on the causes have been performed. Few studies have dealt with this problem by numerical methods because the relationship among the reaction rate, temperature, stress, and strain is too complex to be expressed numerically. The finite element analysis method with a coupled matrix of the relationships is the most suitable for implementation. The results determined with numerical analysis is useful for designing electronic devices, although many parameters are necessary to accomplish the analysis. This paper reports on the kinetic analysis of the curing reaction between an epoxide (Epikote 828) and a carbonic acid anhydride (HN-2200) using a finite element analysis with a coupled matrix. The degree of reaction at a given temperature was determined by titration of the unreacted acid and epoxy groups in the system. Because the curing rates obtained by a power law model were not in good agreement with experiment, the curing rate was expressed as a function of temperature and the degree of reaction by means of a multiple regression analysis. To deal with the curing rate in the finite element analysis, the degree of reaction was defined as one of the variables at the Gaussian integration points in finite elements. Consequently, the analytical results with the new finite element model were in good agreement with the experimental data. This numerical method would be available for predicting the strain in epoxy resins and the degree of reaction throughout the curing process. | |||||
| 権利 | ||||||
| 権利情報 | Copyright © The Japan Society of Polymer Processing プラスチック成形加工学会 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | https://www.jstage.jst.go.jp/browse/seikeikakou/-char/ja/ | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://ci.nii.ac.jp/naid/10009505082/ | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://www.jspp.or.jp/ | |||||
