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Investigation of printed wiring board testing by using planar coil type ECT probe
http://hdl.handle.net/2297/6900
http://hdl.handle.net/2297/6900b4d30ca1-e9c4-498e-a47b-9b7fccfedaf5
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
TE-PR-YAMADA-S-04.pdf (324.3 kB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2017-10-05 | |||||
| タイトル | ||||||
| タイトル | Investigation of printed wiring board testing by using planar coil type ECT probe | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| 著者 |
Yamada, Sotoshi
× Yamada, Sotoshi× Fujiki, Hisashi× Iwahara, Masayoshi× Mukhopadhyay, S. C.× Dawson, Francis P. |
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| 提供者所属 | ||||||
| 内容記述タイプ | Other | |||||
| 内容記述 | 金沢大学環日本海域環境研究センター生体機能計測研究部門 | |||||
| 書誌情報 |
IEEE Transactions on Magnetics 巻 33, 号 5 PART 1, p. 3376-3378, 発行日 1997-01-01 |
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| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 0018-9464 | |||||
| NCID | ||||||
| 収録物識別子タイプ | NCID | |||||
| 収録物識別子 | AA00667933 | |||||
| DOI | ||||||
| 関連タイプ | isIdenticalTo | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | https://doi.org/10.1109/20.617949 | |||||
| 出版者 | ||||||
| 出版者 | IEEE | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | A new application of eddy current testing techniques for investigating trace defects on printed circuit boards is proposed, A test probe consisting of a meander type exciting coil is used to induce eddy currents. The following three experiments are conducted: measuring the induced signal when a circuit trace is cut; measuring the induced signal for a number of traces placed in parallel and with a cut in the centre trace; measuring the induced signal for two back to back right angle traces. The experimental results reveal that it is possible to clearly detect defects and that the signal response obtained is strongly associated with a particular defect pattern. The signals obtained from a high density patterned board have a complicated signal signature and are therefore difficult to interpret. This complexity can be avoided by comparing the signal signature of a known good board with a defective board. The difference signal gives a clear indication of a trace defect. © 1997 IEEE. | |||||
| 権利 | ||||||
| 権利情報 | © IEEE 1997 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
