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Mechanism of Micro Manipulation using Oscillation
http://hdl.handle.net/2297/35231
http://hdl.handle.net/2297/35231e564f258-9db4-408d-ab2e-b04bd700c1a9
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
TE-PR-WATANABE-T-661.pdf (772.1 kB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
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| 公開日 | 2017-10-03 | |||||
| タイトル | ||||||
| タイトル | Mechanism of Micro Manipulation using Oscillation | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| 著者 |
Watanabe, Tetsuyou
× Watanabe, Tetsuyou× Jiang, Zhongwei |
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| 書誌情報 |
Proceedings of the IEEE International Conference on Robotics and Automation (ICRA) = 巻 2006, 号 1641786, p. 661-668, 発行日 2006-01-01 |
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| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 1050-4729 | |||||
| ISBN | ||||||
| 識別子タイプ | ISBN | |||||
| 関連識別子 | 0780395069 | |||||
| ISBN | ||||||
| 識別子タイプ | ISBN | |||||
| 関連識別子 | 978-078039506-0 | |||||
| DOI | ||||||
| 関連タイプ | isVersionOf | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.1109/ROBOT.2006.1641786 | |||||
| 出版者 | ||||||
| 出版者 | IEEE | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | In this paper, we analyze the mechanism of the phenomenon between an endeffector, a micro object and a substrate during a micro manipulation. In a micro range, the attracting forces such as the van der Waals, capillary, and electrostatic forces dominate and course adhesion between the object and the endeffector. The adhesion makes the manipulation of an object difficult. Recently, we developed a method to reduce the attracting/adhesion effect. When bringing an oscillating endeffector close to a micro object on a substrate, the attracting force between the object and the endeffector is reduced, attracting the object to the substrate. Then, it becomes easy to remove the endeffector from the object. Using this method, a micro object can be easily manipulated. However, the mechanism of the phenomenon is still unclear. In this paper, we develop the theoretical model of the system to analyze the phenomenon, and simulate the dynamical motion of the system. Comparing the experimental results, we show the validity of our approach. Using simulation and experiment, we show that the oscillation of the endeffector can reduce the adhesion effect between the endeffector and the object, attracting the object to the substrate. © 2006 IEEE. | |||||
| 著者版フラグ | ||||||
| 出版タイプ | AM | |||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
