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パルスYAGレーザによる脆性材料の割断加工: Siウエハ割断における熱応力解析
http://hdl.handle.net/2297/39631
http://hdl.handle.net/2297/3963180e19abc-6ce5-4d0f-b01d-156c2e236a7f
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
TE-PR-HOSOKAWA-A-120.pdf (3.8 MB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2017-10-03 | |||||
| タイトル | ||||||
| タイトル | パルスYAGレーザによる脆性材料の割断加工: Siウエハ割断における熱応力解析 | |||||
| タイトル | ||||||
| タイトル | Cleaving Process of Brittle Materials with Pulsed YAG Laser: Thermal Stress Analysis in Cleaving Process of Silicon Wafer | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | jpn | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| 著者 |
山田, 啓司
× 山田, 啓司× 西岡, 真吾× 細川, 晃× 上田, 隆司 |
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| 書誌情報 |
精密工学会誌 = Journal of the Japan Society of Precision Engineering 巻 69, 号 1, p. 120-124, 発行日 2003-01-05 |
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| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 0912-0289 | |||||
| NCID | ||||||
| 収録物識別子タイプ | NCID | |||||
| 収録物識別子 | AN1003250X | |||||
| DOI | ||||||
| 関連タイプ | isIdenticalTo | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.2493/jjspe.69.120 | |||||
| 出版者 | ||||||
| 出版者 | 精密工学会 = The Japan Society for Precision Engineering | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | Laser cleaving process is a prospective technique to divide a thin plate of brittle materials into small pieces, because of its high yield ratio and controllability. In addition, the process is carried out without coolant which causes the environmental pollution and the contamination of the electrical devices etched on the wafer. In this paper, laser cleaving of silicon wafer is conducted with pulsed Nd: YAG laser. The temperature of laser spot is measured by means of the two-color pyrometer with optical fiber and the acoustic emission caused by crack propagation is also observed. When the laser spot is scanned at the appropriate interval and velocity, the crack propagates in sequence by the corresponding laser irradiation. As a result, both high linearity of cleaved edge and fine fractured surface roughness are obtained. The thermal stress distribution induced by laser irradiation is analysed with FEM model, in which the stress intensity factor is calculated at the vicinity of the crack tip in order to clarify the criterion of crack propagation. The analysis and experiments reveal that the maximum tensile stress at the crack tip increases with temperature and the crack propagates when the stress intensity factor reaches the fracture toughness of the material. | |||||
| 権利 | ||||||
| 権利情報 | Copyright © 2007 The Japan Society for Precision Engineering 精密工学会 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://www.jspe.or.jp/ | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | https://www.jstage.jst.go.jp/browse/jjspe | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://ci.nii.ac.jp/naid/110001373481 | |||||
