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ヒートサイクル信頼性評価中での配線間に生ずる熱残留応力の有限要素解析による予測
http://hdl.handle.net/2297/36568
http://hdl.handle.net/2297/3656857f3b560-bc44-4d24-b5ef-386b9d6d1ab8
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
TE-PR-YAMADA-T-149.pdf (4.8 MB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2017-10-03 | |||||
| タイトル | ||||||
| タイトル | ヒートサイクル信頼性評価中での配線間に生ずる熱残留応力の有限要素解析による予測 | |||||
| タイトル | ||||||
| タイトル | Prediction for Thermal Residual Stress between Electric Wires during Reliability Assessment by Heat Cycle Test with Finite Element Analysis | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | jpn | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| 著者 |
串崎, 義幸
× 串崎, 義幸× 中村, 省三× 多田, 薫× 山田, 敏郎 |
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| 書誌情報 |
成形加工 = Journal of the Japan Society of Polymer Processing 巻 18, 号 2, p. 149-155, 発行日 2006-02-20 |
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| ISSN | ||||||
| 収録物識別子タイプ | ISSN | |||||
| 収録物識別子 | 0915-4027 | |||||
| NCID | ||||||
| 収録物識別子タイプ | NCID | |||||
| 収録物識別子 | AN10278882 | |||||
| DOI | ||||||
| 関連タイプ | isIdenticalTo | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | 10.4325/seikeikakou.18.149 | |||||
| 出版者 | ||||||
| 出版者 | The Japan Society of Polymer Processing = プラスチック成形加工学会 | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | In recent years, the study of Chip on Board (COB) structures with LSI chips mounted on the substrate has attracted much attention. One of the main technical problems is that the internal electrical wires may disconnect during the heat cycle process due to the differences in the thermal expansion coefficients between component materials. In order to prevent thermal expansion deformation the wires are encased in resin. Until now, the relationship between the physical properties of the resin and the thermal residual stress in the wires has been seldom reported. In this work, the influence of resin physical properties on the thermal residual stress generated during the heat cycle process was theoretically analyzed via finite element analysis. The results show that the thermal residual stress generated in the wire during the heating process is larger than that during the cooling process. During heating the thermal residual stress was influenced by the storage modulus of the rubbery state (ER). | |||||
| 権利 | ||||||
| 権利情報 | Copyright © The Japan Society of Polymer Processing プラスチック成形加工学会 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | https://www.jstage.jst.go.jp/browse/seikeikakou/-char/ja/ | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://ci.nii.ac.jp/naid/10018109183/ | |||||
| 関連URI | ||||||
| 識別子タイプ | URI | |||||
| 関連識別子 | http://www.jspp.or.jp/ | |||||
