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Nd:YAGレーザによるSiウエハの割断加工に関する研究: 冷凍チャックシステムによる効果
http://hdl.handle.net/2297/38627
http://hdl.handle.net/2297/38627b75bb05f-277c-4306-9e1c-98e8d6a06edc
名前 / ファイル | ライセンス | アクション |
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TE-PR-UEDA-T-393.pdf (6.7 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2017-10-03 | |||||
タイトル | ||||||
タイトル | Nd:YAGレーザによるSiウエハの割断加工に関する研究: 冷凍チャックシステムによる効果 | |||||
タイトル | ||||||
言語 | en | |||||
タイトル | Study on Cleaving Process of Silicon Wafer with Nd:YAG Laser: Effect of Refrigerating Chuck System | |||||
言語 | ||||||
言語 | jpn | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
山田, 啓司
× 山田, 啓司× 森田, 精一× 上田, 隆司× 細川, 晃× 田中, 隆太郎 |
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書誌情報 |
Journal of the Japan Society for Precision Engineering, Contributed Papers = 精密工学会誌論文集 巻 72, 号 3, p. 393-397, 発行日 2006-03-05 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 1348-8724 | |||||
NCID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AA11966630 | |||||
DOI | ||||||
関連タイプ | isIdenticalTo | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.2493/jspe.72.393 | |||||
出版者 | ||||||
出版者 | 精密工学会 = The Japan Society for Precision Engineering | |||||
抄録 | ||||||
内容記述タイプ | Abstract | |||||
内容記述 | In this paper, a refrigerating chuck system is developed to reduce the thermal damages of workpiece in laser cleaving process. The system reduces the surface temperature of table below the freezing point of water, and the work material is fixed on the table by the frozen water between the material and the table. The cooling capability of the system is investigated. The system is applied to the laser cleaving process of silicon wafer with cw-Nd:YAG laser. The laser cleaving experiment of silicon wafer is conducted with Nd:YAG laser, then the width of thermal affected zone on the irradiated surface, the roughness of fractured surface and the deviation of cleaving trajectory are measured. The silicon oxide is caused on the surface of wafer in the room temperature, but the refrigerating chuck can prevent the thermal damage and improve the reliability of the cleaving process. By use of the chuck, the smooth fractured surface is achieved and the linearity of the cleaving trajectory is also improved. | |||||
権利 | ||||||
権利情報 | Copyright © 2007 The Japan Society for Precision Engineering 精密工学会 | |||||
著者版フラグ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | http://www.jspe.or.jp/ | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://www.jstage.jst.go.jp/browse/jspe | |||||
関連URI | ||||||
識別子タイプ | URI | |||||
関連識別子 | http://ci.nii.ac.jp/naid/110004656746/ |