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Laser cleaving is a useful method to cut sapphire wafers. A striped pattern on the cleaved surface is observed when a pulsed laser is used. Laser cleaving makes it possible to cut the sapphire along the circular arc. Sapphire wafers can be cleaved by laser irradiating along a pre-made shallow groove.", "subitem_description_type": "Abstract"}]}, "item_4_identifier_registration": {"attribute_name": "ID登録", "attribute_value_mlt": [{"subitem_identifier_reg_text": "10.24517/00008934", "subitem_identifier_reg_type": "JaLC"}]}, "item_4_publisher_17": {"attribute_name": "出版者", "attribute_value_mlt": [{"subitem_publisher": "砥粒加工学会 = The Japan Society for Abrasive Technology"}]}, "item_4_relation_12": {"attribute_name": "DOI", "attribute_value_mlt": [{"subitem_relation_type": "isIdenticalTo", "subitem_relation_type_id": {"subitem_relation_type_id_text": "10.11420/jsat.55.424", "subitem_relation_type_select": "DOI"}}]}, "item_4_relation_28": {"attribute_name": "関連URI", "attribute_value_mlt": [{"subitem_relation_type_id": {"subitem_relation_type_id_text": "http://www.jsat.or.jp/", "subitem_relation_type_select": "URI"}}, {"subitem_relation_type_id": {"subitem_relation_type_id_text": 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